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Recently, with the explosive demand for artificial intelligence (AI) infrastructure, forecasts have emerged that the global semiconductor market will grow to $2 trillion (approximately 2,700 trillion won) by 2030. Consequently, there are claims that semiconductor performance must evolve beyond that of a single chip to an integrated system composed of control centers, warehouses, roads, and complex facilities.
Choi Jang-seok, Executive Vice President of Samsung Electronics' semiconductor division, presented the 'CUBE' strategy at 'Semicon Taiwan,' Asia's largest semiconductor exhibition, as a means to overcome the limitations of memory semiconductor technology. This strategy aims to maximize capacity, optimization, bandwidth, power, and thermal efficiency by stacking memory in three dimensions rather than two, thereby maximizing capacity and increasing data processing speed.
Additionally, efforts are underway to innovate the connection methods between semiconductors. The Semiconductor Equipment and Materials International (SEMI) announced that this year's event will focus on silicon photonics and chip packaging optics (CPO). There are also suggestions that a transition from traditional copper wiring to light-based transmission is necessary to alleviate data transfer bottlenecks. Such changes are becoming increasingly essential as the volume of data generated by AI surges. TSMC plans to lead the market through the development of these technologies.