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SK Hynix Foundry (CEO Lee Dong-jae) recently signed a contract with Elmos Semiconductor SE to expand their collaboration on 130nm technology and secure a long-term wafer supply agreement. The contract was formalized during a signing ceremony held in Frankfurt, Germany, where both companies agreed to further develop their partnership, which has been based on 350nm technology for 18 years.
Under this agreement, SK Hynix Foundry will provide wafer production capacity to Elmos until 2037. SK Hynix Foundry's 130nm technology enables electrical isolation through Deep-Trench Isolation (DTI) features, facilitating high-density high-voltage designs. The first collaborative product, the 'E550.01 Smart 4-Channel eFuse Controller,' is designed to intelligently protect and control complex power networks, with plans for mass production starting in 2027.
Elmos CEO Arne Schneider mentioned, "We have secured a stable production plan until 2037, enhancing supply reliability," while SK Hynix Foundry's CEO Lee Dong-jae stated, "We will strengthen global foundry competitiveness by developing innovative semiconductor solutions for automotive electronics based on a strong technology platform." This contract is expected to provide Elmos with a stable supply source and offer SK Hynix Foundry an opportunity to expand its presence in the automotive semiconductor market.